Varian XM Sputtering System

XM Cassette-to-Cassette Sputtering System

Varian’s XM-2000 Cassette-to-Cassette Sputtering System brings up to date enhanced computer control to the field-proven XM-90 computer controlled system and the XM-8 Sputtering System. We’ve added automatic process control with superior diagnostic capabilities for more efficient deposition and ease of operation. The XM-2000 can process wafers from 3" to 6" in diameter and accommodates odd-size substrates.

System Features

Excellent Film Quality – VersaMag™ deposition source and single-wafer, cassette-to-cassette horizontal sputtering produce superior films.

Process Versatility – A wide variety of metals can be deposited using both reactive and nonreactive gases, with superb run-to-run repeatability and uniformity. Ideal for both R&D and production applications.

Highly Flexible – The system can deposit metal films on the backside as well as the frontside of substrates. Adaptors allow sputtering on odd-size substrates, pieces, and multiple-size wafers within a single run.

Fully Automated – Automatic, touch-screen computer control and straightforward system design facilitate operation and system maintenance.

Production Worthiness – Computerized process and diagnostic control, combined with independently vented and pumped load locks, provide well-monitored and continuous production.

Eliminates Cross-Contamination – Plasma-confinement shields physically isolate process stations and capture precious metals for easy recovery.

Many Options Available – Choose from DC or RF deposition, RF etch, substrate heaters, dual-gas control for reactive sputtering, and other options to customize the XM-90/2000 for your application.

Excellent Film Quality

• Single-wafer sputtering

• Produces superior films

The XM-2000 uses the single-wafer sputtering concept, processing every wafer identically for repeatable films, run after run. Each wafer is placed in precisely the same source-to-substrate geometry, resulting in excellent film quality and reproducibility, as well as good deposition rates. High uniformity across the wafer and wafer-to-wafer repeatability are achieved, eliminating variations commonly observed in batch-processing systems.

The XM-2000’s method of cassette-to-cassette wafer processing minimizes operator handling while maximizing production yields. Wafers are transported very gently, making the XM-2000 the ideal system for processing fragile substrates such as gallium arsenide, backplated silicon, and alumina.

Using a magnetically coupled drive mechanism, the unique wafer-shuttle system transfers individual wafers from the entry load lock to each process station. Substrates are gravity-held during all transport steps; there are no clips or clamping mechanisms used in the transport system.

Sputtering Source

The XM-2000 uses an efficient DC or RF planar magnetron sputtering source, which deposits high-quality films with minimal occlusion of residual gases. A moving magnet array in the cathode assembly ensures the arrival of sputtered atoms from a sufficient range of locations and angles to provide excellent film-thickness uniformity.

The moving magnet array also eliminates the need for wafer motion during processing and delivers efficient target consumption, with reduced material cost per wafer.

VersaMag™ sources are available in multiple sizes to meet specific applications. An RF VersaMag deposition source allows the XM-2000 to sputter nonconductive materials with the same uniformity and repeatability. Each source comes with a dedicated power supply for controlled depositions of up to 5,000 watts