Varian 3290 Sputtering System

Varian 3290 Sputtering System

The Varian 3290 is a turn-key sputtering system, ready for high yield production processing. Leading edge PVD technology enables this latest tool in the 3000 series to deliver advanced sputtering processing. Thus the 3290 is extremely cost-effective for chop manufacturers processing high volume devices such as microcontroller and smart power, because it excels in submicron aluminum metallization with throughput rates of up to 60 wafers per hour.

The 3000 series sputtering systems continue to deliver high productivity to fabrication facilities due to a continuous program of upgrades and enhancements. The most advance system in the line, the 3290 STQ, provides advanced, submicron capability enabling your bad to move one o two generation up the technology ladder with minimum investment.

Vastly improved over older models, and more cost efficient than anything the competition can offer, the 3290 STQ increases uptime by more then 20%, reduces particulates by as much as 50%, and slashed consumables cost up to 50%. The Quantum Planar Magnetron Source alone enhances productivity by 10-20%.

System Performance Benefits

• Expand fab capacity with a turn-key system that delivers 0.6 µm capability for Al metallization and up to 60 wph.

• Achieve maximum process reliability and peace of mind. With the Quantum Source, the 3290 STQ produces top-notch symmetrical step coverage and bottom fill in submicron contacts and vias.

• Cut consumables costs in half. Quantum Source full-surface target erosion conquers the sputtered particle problem and offers two to three times the target life of conventional sources, vastly extending pre-scheduled maintenance intervals.

• Improve cost of ownership by upgrading your existing 3000-series systems with ConMag® to the Quantum® and MiniQuantum® Sources.

• Increase system availability and downsize maintenance costs with new onboard water pump.

• Maintain contamination-free processing with special surfaces, magnetically sealed doors, electropolished argon delivery system, and reduced moving parts in the chamber.

• Eliminate particle generation with Varian's continuous improvement program.

• Achieve new levels of system automation with the powerful, new ECS 3000 controller and efficient software, which are in full compliance with SEMATECH guidelines.

ECS 3000 Performance Benefits

• True multitasking significantly improves uptime.

• Stored process programs allow the computer to control the processing of wafer on a cassette-by-cassette basis.

• Even though wafers from more than one cassette may be in the processing chamber at one time, the controller can accept additional process recipes simultaneously.

• System set-up time is effectively reduced since users can change and add recipes while the system is actually processing wafers.

• Cassette mapping provides efficient processing of partial lots.

• Multiple customer-specified security levels limit system access. Process adjustments are made through a pre-specified optional range of values.

• Up-front CRT display with 17-inch color monitor provides convenient access to system data.

• SEMATECH guidelines ensure that the controller is easy to use. Key colors on a gray scale background highlight critical functions.

• Access is via the lower navigation buttons, simplifying operation.

• Built-in touchscreen, the main interface between the operator and control system, automatically guards against accidental commands by asking for confirmation of all requests to initiate action.

• Commands can be initiated through the touchscreen, trackball, or keyboard for simple character-based information entry, increasing operational flexibility.

• The 486 DX 66 MHz microprocessor replaces the load, wafer load, and process and vacuum controllers, increasing the simplicity of the system and reducing maintenance.

• History log allows further data collection with sorting capabilities to facilitate analysis.