Perkin Elmer Sputtering System

The Perkin Elmer comes in different modules: 2400, 4400, 4410, and the 4450. Perkin-Elmer’s Model4400 production sputtering system is the standard and is designed for high throughput, high yield and flexible process control.

With the4400, a wide range of metals and dielectrics may be deposited from pure, alloyed or preselected target formats for the formation of films of precise thicknesses or compositions. For added production flexibility, up to three8-inch round targets may be sputtered sequentially without breaking vacuum. Alloys or graded interfaces may be formed with the use of an optional RF power splitting network.

The4400 employs a fast-cycle load lock, two-stage cryopump and full-flow Meissner trap to maintain the process chamber at high vacuum and in a clean condition at all times. The process chamber is fabricated of stainless steel for contamination-free operation. A base pressure better than5 ×10⁻⁷ Torr is achievable within3½ minutes from loading substrates into the load lock.

System highlights

• High capacity batch loading: Thirty3-inch or thirteen4-inch wafers can be processed at one time.

• High throughput operation: Automated load lock and controller sequences provide for efficient pumpdown and pallet transfer to process chamber, maximizing throughput.

• High Uniformity: ±7% deposition uniformity guaranteed with water-cooled rotating annular substrate table; ±5% achievable.

• The right sputter mode for each application: Sputter deposition,0–10% RF bias sputter, DC bias sputter, sputter etch to2 kW, RF magnetron, RF diode, DC magnetron, optional RF power splitting.

• Ultra-clean vacuum: Cryopumped and Meissner-trapped process chamber ensures the contamination-free conditions demanded by critical processes.

• Designed for operator safety: Two-button operation initiates pumpdown and load sequence. Safety interlocks on DC and RF supplies.

• Easy maintenance: Removable deposition shields permit easy chamber cleaning. Automatic cryopump regeneration minimizes downtime and inconvenience.

• Key functions clearly displayed: Valve position and system status are continuously displayed by quick-reading LEDs on front panels.

• Easy wafer loading: Tweezer grooves facilitate wafer loading. Nested pallets are optional.

• A fail-safe system: Water flow switches on cathodes, matching network and vacuum system automatically shut the system down in case of cooling system failure.

Module Selection

• 2400: System comes with no loadlock

• 4400: System comes with a loadlock and 3 or 4 8" round targets.

• 4410: System comes with a loadlock and 3 Delta Targets

• 4450: System is a PLC version of the 440 and 4410

• Each module can be setup for RF or DC sputtering with the capability of etch and heat.