Perkin Elmer 2400 8L

High Vacuum for High Performance

The quality, performance and repeatability of your films depend on the quality of vacuum your system provides and, therefore, the cleanliness of the sputtering environment.

Perkin-Elmer’s experience in high-vacuum technology is reflected in the performance of the vacuum pumps offered for the2400 Series and in the choice of materials, components and craftsmanship used.

The right choices: Perkin-Elmer offers a vacuum system for every application: diffusion pumps, turbomolecular pumps and state-of-the-art cryopumps.

At the heart of each of these systems is the Perkin-Elmer Cryo-Pod liquid-nitrogen vapor pump. Its compact design incorporates an8-inch-diameter air-operated poppet valve for high conductance and a liquid-nitrogen shroud which, when full, pumps water in excess of2800 l/s.

All 2400 Series vacuum stations are available with either fully automatic or manual switch-operated valve controls. Diffusion-pumped stations use a variable-conductance, air-operated throttle valve that lets you choose between maximum water-vapor pumping speed and rapid pumpdown.

The Contamination-Free Perkin-Elmer Cryopump

One significant option available for your 2400 system is a contamination-free, closed-cycle, two-stage helium cryopump. This provides efficient, rapid pumping of atmospheric gases and reduces the partial pressures of most unwanted gases to less than5 ×10⁻⁸ Torr.

Automatic Regeneration

Automatic regeneration of the cryopump minimizes downtime by cycling during off-shift periods. Total regeneration time is only three hours.

Typical pumping speeds are 1000 l/s for nitrogen, 100 l/s for hydrogen and 4200 l/s for water vapor. The design is inherently free of oil backstreaming and significantly reduces heat rejection to the surrounding environment.

The2400-8L Load Lock: A Double Benefit

By eliminating the need to break vacuum in the process chamber, the 2400-8L load lock reduces both pumpdown time and contamination of targets and internal chamber surfaces. Typically, a full load of wafers can be transferred from air to a properly maintained process chamber and pumped down to a base pressure of 5 ×10⁻⁷ Torr in less than five minutes.

Load-lock pumping is provided by a mechanical pump shared with the process vacuum system. Load-lock pumpdown and pallet transfer are automatically controlled; the sequence and position of all valves are displayed on front control panels.