CPA 9900 Sputtering System

The CPA 9900 Sputtering System is a modular, versatile PVD platform designed to accommodate a wide range of sputtering applications and process requirements. Its modular architecture allows the system to be configured and expanded to meet specific production or research needs. The standard sputter zone is approximately 12" wide × 14" long. This is a conveyor-style layout, making it well suited for high thru put. Overall system length can be customized based on the number of process chambers and modules incorporated into the system.

Process Parameter Control Ranges:

A. Sputtering pressure: 5 microns to 30 microns

B. Conveyor speed: 0.1 to 80 cm.min.

C. D.C. deposition power level: 100 to 9000 watts

D. R.F. deposition power level: 50 to 3000 watts

E. R.F. sputter clean power level: 15 to 1000 watts

F. Substrate heating: Inline heating is variable from ambient to 350°C.

Vacuum Performance:

A. Ultimate pressure (total system) 2X 10(-7) in 16 hours clean, dry and empty (after venting to atmosphere).

B. 5 x 10(-7) in 30 minutes (after conditioning the system with load locks opened to one atmosphere of N2, then roughed to 50 microns before opening load lock valves).

C. Rate of rise: more than 6 minutes to 1 x 10(-4) torr clean, dry and empty.

D. Vacuum tight to less than 5 x 10(-10) standard atmosphere cc helium/second.

Optional Features Available on the 9900 Series Systems

• Multiple Cathodes

• Multiple Power Supplies

• DC and RF in any mix

• With/without Sputter Etch

• With/without Substrate Heating

• Turbo Pump Hi-Vac

• Cryo Pump Hi-Vac

• Sputter Up/Sputter Down

• With/without Load Lock

• Various Numbers of Process Gases

• Rail Bias

• Installed RGA

• With/without Window Shutters

• Unequipped Chamber for Future Expansion

• Target Assembly Size: 15”

* The length of the system depends on the number of work stations. Add 13” for additional cathodes and substrate heater; add 17-7/8” for sputter etch pre-clean station.

Utility Requirements:

Power: 208V, 100 amps, 3 phase 50/60 Hz, 5 wire wye. (amps depends on options)

Water Temperature: 50 - 75°F (10-24°C)

Air: 70 to 100 PSIG (6 to 8 ATU) filtered, 1 CFM.

Sputtering Gas: Typically 5 PSIG (1.3 ATU) Argon