PERKIN ELMER  4410                   PERKIN ELMER   4400                         PERKIN ELMER 2800

The 4400 Series of RF Plasma systems for sputtering and etching reflect an advanced design concept based
on a high capacity load lock that permits wafer loading without breaking vacuum in the process chamber.

Created specifically for the production environment, this Ultek design provides you with significant advantages whenever you must             combine quality with high yield and high throughput. The means to handle almost any thin film coating or etching requirement                             you may have is provided by a broad range of operating modes. These include; DC magnetron, RF magnetron and RF diode                         sputter deposit, bias sputter, reactive sputter, sputter etch, plasma etch and reactive ion etch.

                                                

 

 

Physical Vapor Deposition PVD coating technology – DC Magnetron sputtering, RF sputtering, Electron Beam Evaporation or
Thermal Evaporation Systems – there is probably a more advanced CPA version that is tested, proven and will give you more for
your money.