MRC 902                                                           MRC 903                                              MRC 943

MRC 903
Loadlocked 3 Target DC Sputtering System with RF Etch with a PC Controller upgrade. 3 DC cathodes 4¾” x 14 7/8”
with no shutters, substrates are transported from station to station via chain drive.                   

   

MRC 943

3 Target DC Sputtering System. The 943 comes with heat in etch platform area instead of loadlock area.
System has a PC and PLC control system. 3 Cathodes 4-3/4” x 14-7/8” in a sputter down configuration.

        

MRC 902

Load-Lock 2 target in-line sputtering system. Holds a 12 inch plate with PLC and touch screen. Comes
equipped with a 8" CTI Cryo and 1020R air cooled compressor.
Runs RF/DC process, substrate heat and etch.

                                

                                      

          

 

Physical Vapor Deposition PVD coating technology – DC Magnetron sputtering, RF sputtering, Electron Beam Evaporation or
Thermal Evaporation Systems – there is probably a more advanced CPA version that is tested, proven and will give you more for
your money.